July 8 (UPI) — Apple announced Wednesday that it is expanding its deal with Broadcom to design wireless connectivity chips in an effort to source more of its components in the United States.
Apple said the new commitment would increase its spending with Broadcom to more than $30 billion, leading to the production of more than 15 billion chips and supporting “hundreds of American jobs.”
CEO Tim Cook said Apple was proud to deepen its investments in U.S.-based suppliers. He also praised the Trump administration for supporting projects such as the Apple-Broadcom agreement.
“Apple and Broadcom have a long history together, and this new phase of our partnership further accelerates our commitment to American manufacturing and innovation,” he said.
Apple said its commitment would allow Broadcom to expand and modernize its facilities in Fort Collins, Colo., where it will produce advanced radio frequency components and advanced wireless connectivity technologies.
Broadcom CEO and President Hock Tan said the investment will allow the company to expand its “manufacturing footprint.”
“Broadcom is proud to continue to work with Apple after decades of success together, and we share a strong commitment to American innovation,” Tan said.
Apple has long worked with Broadcom to develop components for its wireless cellular systems. In 2023, the companies reached a deal for Broadcom to develop 5G radio frequency components and FBAR filters.
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